Capabilities

Seven services. One floor.

Every service below runs out of our 25,000 sq ft facility in Greene, NY. That means tighter feedback loops between engineering, SMT, through-hole, harness, and final test, and fewer hand-offs where problems hide.

01

Surface Mount

GC-CAP-01

Three surface mount lines handle fine-pitch components on single-sided, double-sided, and mixed-technology boards. Automated solder paste inspection before placement and AOI after reflow mean defects are caught early, not at end-of-line.

  • Three dedicated SMT lines with automated paste inspection
  • Fine-pitch, BGA, QFN, 0201 capability
  • Lead-free (RoHS) and leaded workflows
  • AOI after reflow on every panel
Surface mount pick-and-place line on the GC Controls production floor
FIG. 01 · SMT LINE, REFLOW SIDEGREENE, NY
02

Through Hole

GC-CAP-02

Through-hole assembly via wave solder or hand solder, depending on the board. Wave solder for volume, hand solder for low-volume or rework situations where wave would not be cost-effective.

  • Multiple wave solder machines
  • Selective soldering available
  • Hand-soldered assemblies for low-volume and prototype runs
  • DI wash after wave for clean, inspectable assemblies
Wave solder machine producing through-hole assemblies
FIG. 02 · WAVE SOLDERGREENE, NY
03

Wire Harness

GC-CAP-03

Wire harness and cable assembly to your prints. Crimp, solder, and over-mold terminations; labeling, shrink, and continuity-tested before ship. Good for panel interconnects, power distribution, and control cables.

  • Crimp, solder, and overmolded terminations
  • Custom labeling and shrink-tubing
  • Continuity-tested every harness
  • Low- and mid-volume runs from prints
Wire harness assembly station with color-coded conductors on a build board
FIG. 03 · HARNESS BENCHGREENE, NY
04

Complete Build

GC-CAP-04

Turnkey builds that combine boards, harnesses, enclosures, and mechanical integration into a finished, tested assembly. We can build from your BOM, source components, fabricate custom test fixtures, and ship complete.

  • Board + harness + enclosure integration
  • Metal and plastic enclosure handling
  • In-house custom test fixture design and fabrication
  • Final functional test before ship
Engineering workstation with a completed electromechanical assembly under test
FIG. 04 · FINAL INTEGRATION & TESTGREENE, NY
05

Flex Circuit

GC-CAP-05

Assembly on flexible and rigid-flex circuits for applications where space, weight, or bend radius rules out conventional boards. Handling adapted for the substrate. No rough handling on delicate flex.

  • Flex and rigid-flex assembly
  • Adapted handling for fragile substrates
  • SMT + through-hole on flex as required
Flexible printed circuit with visible copper traces held at an assembly bench
FIG. 05 · FLEX SUBSTRATE HANDLINGGREENE, NY
06

Conformal Coat

GC-CAP-06

Conformal coating on finished assemblies for protection against moisture, dust, chemicals, and vibration. Masking done by hand where tolerances are tight.

  • Acrylic, urethane, and silicone coating options
  • Hand-masking for tight-tolerance areas
  • Post-coat inspection under UV
Circuit board with a freshly applied glossy conformal coating held at a coating station
FIG. 06 · CONFORMAL COATINGGREENE, NY
07

Potting & Encapsulation

GC-CAP-07

Potting and encapsulation for assemblies that ship into harsh environments or need full electrical isolation. Mix, pot, and cure to spec. We work with customer-provided compounds or recommend one.

  • Full potting and partial encapsulation
  • Two-part epoxies, urethanes, silicones
  • Vacuum degassing where bubbles matter
Electronic modules filled with potting compound on a workbench
FIG. 07 · POTTING & CUREGREENE, NY

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